Thermal Conductive Adhesive Sealant

Stars-922 heatsink plaster CPU thermal conductive glue with strong adhesive, applicable for 3D printers.

• Stars-922 heatsink plaster thermal conductive glue.
• Thermal properties, strong adhesion.
• Convenient to use.

Specifications:

• Model: STARS-922
• Thermal conductivity : >0.671 W/m-k
• Thermal resistance : <0.06 °C -in2/W
• Strength of connected buildings:1.5map
• Surface curing time 10min/25 degree Celcius
• Net Weight: 5g

Note:

• Higher the temperature, the faster the cure.
• The proposed smear thickness: 0.1-0 .5mm, the thinner the better.
• For the surface to be bonded before use, please clean with a solvent (such as alcohol), avoid cleaning with detergent before being applied upon the surface clean.
• Item colour displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated the same.

• Thermal Conductive Adhesive Sealant (Vacuum packed) x 1pcs